发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING CAPACITOR OF IMPROVED CHARACTERISTICS |
摘要 |
PURPOSE: A method for manufacturing semiconductor device is provided to improve capacitor characteristics by enlarging capacitance of the capacitor and by reshaping the capacitor. CONSTITUTION: An insulating film(2) is formed on a semiconductor substrate(1). A hard mask harder to polish than the insulating film upon chemical mechanical polishing and having a greater selective ratio with respect to the insulating film than a resist film is formed on the insulating film under a predetermined etching condition. A hole(20) is formed penetrating the hard mask and the insulating film to extend in a vertical direction with respect to a main surface of the semiconductor substrate. A capacitor lower electrode(8) is formed along a side surface of the hole. A capacitor dielectric film(9) is formed along a surface of the capacitor lower electrode. A capacitor upper electrode(10) is formed to contact a surface of the capacitor dielectric film.
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申请公布号 |
KR20040065975(A) |
申请公布日期 |
2004.07.23 |
申请号 |
KR20030065796 |
申请日期 |
2003.09.23 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
MATSUMURA AKIRA |
分类号 |
H01L21/8242;H01L21/02;H01L21/321;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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