MODULAR SYSTEM FOR MOULDING ELECTRONIC COMPONENTS AND KIT-OF-PARTS FOR ASSEMBLING SUCH A MODULAR SYSTEM

摘要

The invention relates to a modular system for moulding electronic components, comprising at least three separate system modules; a press module for moulding the electronic components; a loader module for loading the electronic components to be moulded from a cassette to a press module; and a service module configured to at least partially control each of the other system modules. The invention also relates to a kit-of- parts for assembling such a modular system.