Design tool for integrated circuit design

摘要

A method and software relating to determining whether a square die fits into a package without generating drawings. Package parameters are defined and used to calculate die characteristics. Calculated die characteristics are compared to defined package parameters and/or to calculated package parameters to make a determination of whether a die with the calculated characteristics fits into a package as defined by its parameters. The method and software allow design of dies to fit packages, the design of packages to fit dies, and simultaneous design of dies and packages that fit one another.