发明名称 RESIN COMPOSITION, RESIN SHEET, RESIN CURED ARTICLE, AND RESIN SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition capable of providing excellent thermal characteristics.SOLUTION: A resin composition contains an epoxy compound and a triphenyl benzene compound. The triphenyl benzene compound is a compound containing 1,3,5-triphenyl benzene as a skeleton and reactive groups introduced to the skeleton. The total number of the reactive groups is 4 or more and 6 or less.
申请公布号 JP2016204604(A) 申请公布日期 2016.12.08
申请号 JP20150091610 申请日期 2015.04.28
申请人 TDK CORP 发明人 HARAI TOMOYUKI;EBISAWA AKIRA
分类号 C08G59/40 主分类号 C08G59/40
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