发明名称 |
RESIN COMPOSITION, RESIN SHEET, RESIN CURED ARTICLE, AND RESIN SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of providing excellent thermal characteristics.SOLUTION: A resin composition contains an epoxy compound and a triphenyl benzene compound. The triphenyl benzene compound is a compound containing 1,3,5-triphenyl benzene as a skeleton and reactive groups introduced to the skeleton. The total number of the reactive groups is 4 or more and 6 or less. |
申请公布号 |
JP2016204604(A) |
申请公布日期 |
2016.12.08 |
申请号 |
JP20150091610 |
申请日期 |
2015.04.28 |
申请人 |
TDK CORP |
发明人 |
HARAI TOMOYUKI;EBISAWA AKIRA |
分类号 |
C08G59/40 |
主分类号 |
C08G59/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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