CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING

摘要

The uniformity of electroplating a metal (e.g., copper) on a semiconductor wafer is improved by using an electroplating apparatus having a flow-shaping element positioned in the proximity of the semiconductor wafer, wherein the flow-shaping element is made of a resistive material and has two types of non-communicating channels made through the resistive material, such that the electrolyte is transported towards the substrate through both types of channels. The first type of channels is not perpendicular to the plane defined by a plating face of the substrate. The second type of channels is perpendicular to the plane defined by the plating face of the substrate. The channels of the first and second type are substantially spatially segregated. In one embodiment a plurality of channels of the first type are located in the central portion of the flow-shaping element and are surrounded by a plurality of channels of the second type.

主权项

1. An electroplating apparatus comprising:
(a) a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substantially planar substrate; (b) a substrate holder configured to hold the substantially planar substrate such that a plating face of the substrate is separated from the anode during electroplating; (c) a flow-shaping element comprising a substrate-facing surface and an opposing surface, the flow-shaping element comprising an ionically resistive material with a plurality of non-communicating channels made through the flow-shaping element, wherein said non-communicating channels allow for transport of the electrolyte through the flow-shaping element during electroplating from the opposing surface to the substrate-facing surface of the flow-shaping element, wherein the channels comprise a first plurality of channels that are not perpendicular to a plane defined by the plating face of the substrate and a second plurality of channels that are perpendicular to the plane defined by the plating face of the substrate, and wherein the first plurality of channels and the second plurality of channels are substantially spatially segregated.