SEMICONDUCTOR MODULE COOLER AND METHOD FOR MANUFACTURING SAME

摘要

A semiconductor module cooler for reducing a pressure loss of a coolant includes a first plate mounted with a first semiconductor module; a jacket disposed under the first plate and having a distribution portion, and first and second through-holes separated from each other to be disposed at end portions of the depression respectively; an inlet-side header disposed to cover the first through-hole from under the jacket; an outlet-side header disposed to cover the second through-hole from under the jacket and extending in parallel to the inlet-side header; and a plurality of cooling fins disposed in the depression and extending from above a distribution portion of the inlet-side header to above a water collection portion of the outlet-side header.

主权项

1. A semiconductor module cooler, comprising:
a first plate mounted with a first semiconductor module; a jacket disposed under the first plate, and having a depression on a first plate side, and first and second through-holes separated from each other to be disposed at end portions of the depression respectively; an inlet-side header having a distribution portion disposed to cover the first through-hole from under the jacket, and an inlet-side pipe portion extending from the distribution portion in a longitudinal direction of the distribution portion; an outlet-side header having a water collection portion disposed to cover the second through-hole from under the jacket, and an outlet-side pipe portion extending from the water collection portion in a longitudinal direction of the water collection portion and in parallel to the inlet-side header; and a plurality of cooling fins disposed in the depression between the first plate and the jacket, and extending from above the distribution portion of the inlet-side header toward above the water collection portion of the outlet-side header.