| 摘要 |
PURPOSE:To prevent the malfunction attributable to alpha-particles discharged from package part or lid material by covering the surface of the semiconductor pellet of airtightly sealed semiconductor device with gelatinous silicone resin. CONSTITUTION:A semiconductor chip 25 is mounted on the diatouch part of semiconductor tip package 21 having an outer connecting lead 22. Then, the electrode 26 of semiconductor tip and outer connecting lead 22 are ultrasonically bonded by means of a fine aluminum wire 27. A potting of gelatinous silicone resin is effected on the semiconductor tip and heat-treatment is conducted on them for hardening to form a gelatinous silicone resin film 28 of a thickness greater than 50mu. After these procedures, lid material 23 composed of Cobar is welded securely to the semiconductor package 21 in a sealing manner. By this means, malfunction attributable to alpha- particles and the cracking of resin film by heat stress can be avoided. |
