| 摘要 |
A plastic-encased semiconductor component (20), with a semiconductor body (100) which is fastened to a first principal face of a base (50, 60) and has electrical leads (32, 34, 36), is to be improved in such a way that it meets all requirements concerning power semiconductor components. This is achieved by the plastic casing (24) having an outer face (122) which is arranged, at a distance, essentially parallel to the plane of the rear principal face (16) of the base (50, 60) and is slightly set back with respect to the base. <IMAGE> |
