发明名称 T-DIE FOR MAKING LOW VISCOSITY RESIN FILM
摘要 PURPOSE:To obtain a T-die capable to obtain favorable product when applied to the film formation by extrusion of low viscosity resin by a structure wherein a feed manifold and a pressure equalizing manifold are connected with each other through a large number of fine molten resin passages. CONSTITUTION:When pressure is applied, low viscosity resin, which fills a feed manifold 3 with an enough large volume and an enough large sectional area for a flow passage, is past through respective molten resin passages 4 with a nearly uniform flow rate so as to shift itself in a pressure equalizing manifold 5 in order to emit itself uniformly over the whole width of a die through a die slit 6. The extrusion of low viscosity resin from a wide breadth die can be possible by making the volume of the feed manifold 3 enough larger than that of the pressure equalizing manifold 5 and normally the ratio of said volumes is necessary at least 1.5:1. In addition, when the breadth of the die is larger than usual, the further the molten resin passages 4 are located from a molten resin receiving port 2, the denser they are arranged or the larger the sectional area of a passage 4 is made so that the amount of molten resin shifted to the pressure equalizing manifold is uniform in the respective passages 4.
申请公布号 JPS5995114(A) 申请公布日期 1984.06.01
申请号 JP19820205324 申请日期 1982.11.22
申请人 KASAMATSU TADASHI 发明人 KASAMATSU TADASHI
分类号 B29C47/14;B29B7/00;B29C47/00;B29C47/06;B29C47/16;B29C47/92;B29K96/00 主分类号 B29C47/14
代理机构 代理人
主权项
地址