| 摘要 |
PURPOSE:To obtain a semiconductor device having low cost and high reliability by forming a groove for preventing resin flash burr to the surface of a dam for a lead frame. CONSTITUTION:In a lead frame 11 for a resin seal type semiconductor device, grooves 18 for preventing resin flash burr are shaped to the surfaces of dams 17 for the lead frame 11. Consequently, resin pressure at the time of resin mold is made to escape to the grooves 18 for preventing the resin flash burr in the dam sections on parting surfaces, and the generation of the resin flash burr on the surface of an outer lead can be obviated. Accordingly, the semiconductor device having low cost and high reliability can be acquired.
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