| 摘要 |
PURPOSE:To remarkably reduce a time required for the lifting of a capillary and to shorten a bonding time, by using a lifting means to vary a height position of an electric torch and by setting a rise position of the capillary in accordance with the height position of the torch. CONSTITUTION:Wire bonding is applied to a semiconductor 31 located on a position where an electric torch 19 interferes with a large-scaled part 32 at the time of a bonding operation. Then a lifting drive cylinder 21 is made on a state of contraction, and the electric torch 19 is positioned as high as it does not interfere with the large-scaled part 32. Further, a revolution angle of an AC servo motor 18 is set so that a rise position of a capillary 7 is also made high by a distance Z1 from a substrate 2 in accordance with the position of the electric torch 19. Hence, a time required for lifting the capillary 7 is remarkably reduced to shorten a bonding time. |
