发明名称 OXIDIZATION-PROOF SYSTEM FOR WIRE BONDER
摘要 PURPOSE: To avoid oxidation of a wire bonder by cylindrical feeding a reductive gas round the wire spool and by mounting a torch at the lower of a wire feeding capillary along one of reductive gas discharge tubes disposed at both ends of the capillary. CONSTITUTION: On the inner top face of a cover 1 a diffuser 6 is disposed to inject an inert gas from a gas vessel 9 through a solenoid valve 11 periodically opened and closed by a timer 12 and a gas flow rate adjuster 10, thereby forming a reductive gas atmosphere round a spool 2 wound with the wire 20 to avoid oxidating the wire. Reductive gas discharge tubes 31, 32 are disposed at both ends of a wire feeding capillary 5 and a torch 30 is disposed at the lower end of the capillary 5 along the tube 32. This prevents a ball formed from the wire 20 by the discharge of the touch 30 from oxidation, thus avoiding the oxidation of the wire bonder.
申请公布号 JPH0225044(A) 申请公布日期 1990.01.26
申请号 JP19890127972 申请日期 1989.05.23
申请人 SANSEI ELECTRON CO LTD 发明人 WANNKIYOON CHIYOI;JIYONNHAN KIMU
分类号 B23K20/00;B23K20/14;H01L21/00;H01L21/60 主分类号 B23K20/00
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