POLISHING PAD AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is a polishing pad whereby minute defects to be detected after polishing a subject to be polished can be sufficiently reduced in the cases where measurement with a particle size equal to or smaller than 26 nm is performed, and excellent surface planarity of the subject can be achieved. The polishing pad is provided with: a polishing layer (110) having a polishing surface for polishing a subject to be polished; an intermediate layer (120), which is provided on the reverse side of the polishing surface of the polishing layer, and which has a larger deformation amount (C) than that of the polishing layer when the intermediate layer is compressed in the thickness direction; a hard layer (130) having the deformation amount (C) that is smaller than that of the polishing layer; and a cushion layer (140) having the deformation amount (C) that is larger than that of the intermediate layer. The polishing layer, the intermediate layer, the hard layer, and the cushion layer are laminated in this order from the side close to the polishing layer.