| 摘要 |
PURPOSE:To improve thermal shock resistance during the mounting by providing a recess in the extremity part of each internal lead and carrying out wire bonding to the recess. CONSTITUTION:A recess 8 is provided in the end part of each internal lead 5a to be sealed with resin 4 and a bonding wire 3 is bonded to the lead 5a at the recess 8. For example, the recess having a depth of 30-50mum, a width of 300-500mum is formed at the position 200-300mum from the end of the internal lead 5a by half etching. Then, a semiconductor element 1 is bonded to an island part 2 surrounded by a plurality of internal leads 5a each surface thereof having been subjected to plating 7, and the electrode pads on the semiconductor element 1 and the recess 8 in the leads 5a are connected via bonding wires 3 respective ly, and the whole body except the external leads 5b is airtightly sealed resin 4. |
