| 摘要 |
A chip carrier (12) is provided with conductive pads (14) which are to be arranged to communicate electrically to the conductor strips (26) on the circuit board (24) by contacts (18). The contacts are disposed in an array in a socket housing (10) having an outside wall (44). Each contact is V-shaped with front and rear beams (32,30). The rear beam is mounted adjacent to the outside wall and to an intermediate wall (46) of the housing. The front beam has a respective upper, lower part and a retention part (34). A pivot elbow (38) provides a pivoting motion for the whole of the front beam. The retention part is skew relative to the lower part. Consequently when the carrier is inserted into the housing the retention part engages resiliently with a corresp. conductive pad. A second co-planar V-shaped part (40) of the contact has its upper arm formed by the base joining the beams of the first V-shaped part of the contact. An area (41) of the second part contacts the conductive strip. |
