MOLD FORMATION FOR SYNTHETIC RESIN-SEALED ELECTRONIC COMPONENT,申请号JP19900055965-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MOLD FORMATION FOR SYNTHETIC RESIN-SEALED ELECTRONIC COMPONENT
摘要
申请公布号	JPH03257836(A)	申请公布日期	1991.11.18
申请号	JP19900055965	申请日期	1990.03.07
申请人	ROHM CO LTD;SONY CORP	发明人	MAEDA MASAHIDE;TANIGUCHI YOSHIKUNI;UTENA HISASHI;SAKURAI TERUYASU
分类号	H01L21/56;H01L23/50	主分类号	H01L21/56
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Divider for an electronic timepiece

Superheterodyne receiver with a digitally adjustable tuning arrangement

Time expander circuit for a frequency-to-digital converter

External management of satellite linked exchange network

Method of making stained glass effect articles

Information transfer system

Stabilizing pyrolysis naphtha

Filtering process

Method and device for cleaning sheets

Process for preparing waterless printing masters comprising copolymer of siloxane and thermoplastic blocks

Composite helicopter spar and means to alleviate stress concentration

Cutting tool and method for making same

Apparatus for conveying asphalt concrete mixtures

Method of and device for the analysis of samples by means of flameless atomic absorption spectroscopy

Gastrointestinally active thioureas

Glow plug connector

Device for fixing a bearing on a concrete mass

Sealing devices

Sequence valve for clamping apparatus