| 摘要 |
<p>PURPOSE: To provide a miniaturized electric component for forming a dielectric element by printing a solid layer of a conductive material to a supporting surface, focusing the negative image of a helical coil by using a laser beam of a single pulse, and removing the solid layer other than the helical coil. CONSTITUTION: A multi-chip layer is printed on ferrite layers 23-27, and a first ferrite layer 34 is the lowest layer of a chip and belongs to the multi-chip layer 27. For a coil conductor coil 40, a first solid conductive layer 36 is printed on the upper surface of the ferrite layer 34, then a prescribed pattern of the negative image is focused on the conductive layer 36 by using a converged laser beam, and a part of the layer 36 is removed so as to leave the conductive coil 40. Thus, the chip is further miniaturized compared to a conventional device.</p> |
