发明名称 CERAMIC PACKAGE, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a ceramic package having airtight reliability in which a lid plate or a brazing material is not melted partially by the transmission heat or electric resistance heat, even if a metal lid plate is seam welded to the upper surface of a metal frame bonded above a metalization layer surrounding an opening via the brazing material.SOLUTION: The ceramic package includes a package body 2a having a pair of surfaces 3, 4 having a rectangular outer shape in the plan view, and side faces 5a, 5b located between these four sides, a cavity 6 opening to one surface 3 side of the body 2a and having a rectangular shape in the plan view, a metalization layer 10 formed along the surface 3 of the package body 2a surrounding the opening of the cavity 6, and having a rectangular frame-like shape in the plan view, and a metal frame 11 being bonded to the upper surface of the metalization layer 10 via brazing material layers 9(9a, 9b). A pair of sides facing in the surface 3 surrounding the opening of the cavity 6 have a recess 3a located on the center side of them, and a pair of planar parts 3b sandwiching the recess 3a.SELECTED DRAWING: Figure 1
申请公布号 JP2016171094(A) 申请公布日期 2016.09.23
申请号 JP20150047797 申请日期 2015.03.11
申请人 NGK SPARK PLUG CO LTD 发明人 HASEGAWA MASAMI
分类号 H01L23/02;H01L23/08;H01L23/10;H01L23/12 主分类号 H01L23/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利