发明名称 Semiconductor device
摘要 A decrease in resistance against an abnormal current of a semiconductor device is suppressed. A first transistor is sandwiched between two second transistors (a first one and a second one of the second transistors) in a second direction. Both of a distance between a second source contact and a second drain contact that are coupled to the one second transistor, and a distance between a second source contact and a second drain contact that are coupled to the other second transistor are larger than a distance between a second source contact and a second drain contact that are coupled to a third one of the second transistors located farthest from the first transistor in the second direction.
申请公布号 US9450089(B2) 申请公布日期 2016.09.20
申请号 US201514606064 申请日期 2015.01.27
申请人 RENESAS ELECTRONICS CORPORATION 发明人 Toda Takeshi;Okushima Mototsugu
分类号 H01L27/148;H01L29/78;H01L27/088;H01L27/02;H01L21/8234 主分类号 H01L27/148
代理机构 Mattingly & Malur, PC 代理人 Mattingly & Malur, PC
主权项 1. A semiconductor device comprising: a first transistor having a first gate electrode, a first source region, and a first drain region, the first gate electrode extending in a first direction; a plurality of second transistors each having a second gate electrode, a second source region, and a second drain region, the second gate electrode extending in the first direction and the plurality of second transistors being arranged side-by-side along a second direction intersecting with the first direction; a first source contact coupled to the first source region; a first drain contact coupled to the first drain region; a plurality of second source contacts each coupled to the second source region different from each other, and electrically coupled to each other; and a plurality of second drain contacts each coupled to the second drain region different from each other, and electrically coupled to each other, wherein the first transistor is sandwiched between a first one of the second transistors and a second one of the second transistors in the second direction, wherein both of a first distance between the second source contact and the second drain contact of the first one of the second transistors, and a second distance between the second source contact and the second drain contact of the second one of the second transistors are larger than a third distance between the second source contact and the second drain contact that are coupled to a third one of the second transistors located farthest from the first transistor in the second direction, wherein, in the first one of, the second one of, and the third one of the second transistors, an element isolation film is located between the second gate electrode and the second drain region, and wherein, in the second direction, both of a width of the element isolation film in the first one of the second transistors and a width of the element isolation film in the second one of the second transistors are larger than a width of the element isolation film in the third one of the second transistors.
地址 Tokyo JP