发明名称 |
COPPER ALLOY FOR ELECTRICAL AND ELECTRONIC EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRICAL AND ELECTRONIC EQUIPMENT, AND CONDUCTIVE COMPONENT AND TERMINAL FOR ELECTRICAL AND ELECTRONIC EQUIPMENT |
摘要 |
A copper alloy for an electric and electronic device, which has a reliably and sufficiently excellent stress relaxation resistance; and excellent bendability, is provided. In addition, a copper alloy sheet and a terminal using the copper alloy are provided. The copper alloy includes: Zn at 23 mass% or higher and at 36.5 mass% or lower; Sn at 0.1 mass% or more and 0.9 mass% or less; Ni at 0.15 mass% or more and lower than 1.0 mass%; Fe at 0.001 mass% or more and lower than 0.10 mass%; Co at 0.001 mass% or more and lower than 0.1 mass%; P at 0.005 mass% or more and 0.1 mass% or less; ; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni of a Fe content to a Ni content satisfies 0.002‰¤Fe/Ni<0.7 by atomic ratio, a ratio (Ni+Fe)/P of a total content (Ni+Fe) of Ni and Fe to a P content satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.3<Sn/(Ni+Fe)<2.9, and a special grain boundary length ratio, LÃ/L, is 10% or more, LÃ/L being a ratio of Là to L, Là being a sum of each grain boundary length of: ˆ‘3; ˆ‘9; ˆ‘27a; and ˆ‘27b special grain boundaries. |
申请公布号 |
EP2977476(A4) |
申请公布日期 |
2016.12.28 |
申请号 |
EP20130878726 |
申请日期 |
2013.08.29 |
申请人 |
Mitsubishi Materials Corporation;Mitsubishi Shindoh Co., Ltd. |
发明人 |
MAKI, Kazunari;MORI, Hiroyuki;YAMASHITA, Daiki |
分类号 |
C22C9/04;C22F1/08;H01B1/02;H01B5/02;H01L23/48;H01L23/50 |
主分类号 |
C22C9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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