SUPPORT MEMBER FOR ORGANIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a support member for an organic substrate which can reduce foaming and peeling an interface between an organic substrate and a support member while securing good conveying properties of the organic substrate and sufficient peelability from the organic substrate.SOLUTION: There is provided a support member 10 for an organic substrate for temporarily stuck to an organic substrate 12 in manufacture of an electronic device having the organic substrate 12 which has a resin film base material 2 and a resin layer 4 that is provided on one surface side of the resin film base material 2 and contains a thermosetting resin, where when the resin layer 4 has been subjected to a heating treatment on a heating condition that the resin layer is heated sequentially at 130°C for 30 minutes and at 170°C for 60 minutes in a state of being stuck to a resist layer formed from AUS (registered trademark) 308 being a solder resist ink for substrate, a 90° peeling strength with respect to the resist layer of the resin layer 4 after subjected to the heating treatment is 200 N/m or less at 25°C and 2 N/m or more at 175°C.SELECTED DRAWING: Figure 2