| 摘要 |
Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes comprising (A) a release layer and (B) an adhesive layer wherein the release layer (A) comprises (a1) a resin 1 having a softening point of 200° C. or more and (a2) a resin 2; the resin 2 after curing has capable of being dissolved at 5% by mass or more, at 25° C., in at least one of solvents selected from hexane and the like. |
