| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wire bonding structure which allows for avoiding laser irradiation to places that should not be irradiated with a laser while reducing the useless energy of laser, and for bonding a wire and an object to be bonded more firmly.SOLUTION: The manufacturing method of a wire bonding structure includes a step for preparing a bonding wedge 1 having a light incidence surface 112 and a light exit surface 131 spaced apart from each other, and a step for bonding a wire 6' and a first object to be bonded 71 by irradiating the wire 6' with a laser 881 via the light exit surface 131, while holding the wire 6' by means of the light exit surface 131 and the first object to be bonded 71. |
