SEMICONDUCTOR PACKAGE ASSEMBLY WITH A METAL-INSULATOR-METAL CAPACITOR STRUCTURE

摘要

The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first semiconductor die (302). A first redistribution layer (RDL) structure (308) is coupled to the first semiconductor die. The first redistribution layer (RDL) structure includes a first conductive trace (452b) disposed at a first layer-level. A second conductive trace (454b) is disposed at a second layer-level. A first inter-metal dielectric (IMD) layerc (318) and a second intermetal dielectric (IMD) layer (456b), which is beside the first inter-metal dielectric (IMD) layer, are disposed between the first conductive trace and the second conductive trace, resulting in a metal-insulator-metal (MIM) capacitor structure.