| 摘要 |
PROBLEM TO BE SOLVED: To provide a functional material which can achieve a dense metal/alloy filling structure, and is applicable to an electrode material, electrolytic material, wiring material, electronic component bonding material, sputtering target, and the like, and to provide an electronic device in which the functional material is applied to a functional part, an electromagnetic wave absorbing/shielding device and a method suitable for production thereof.SOLUTION: A binding region 1 has a nanocomposite structure containing an intermetallic compound or a metallic compound, and filling the periphery of metal/alloy particles 3 with a size of 200 nm or less. The binding region may have a nanocomposite structure containing a crystalline or amorphous glass component or ceramic. The metal/alloy particles 3 have a nanocomposite structure, and the minimum full size is preferably 1 μm or less. |
