配線体、配線基板、タッチセンサ、及び配線体の製造方法

摘要

This wiring body (1) is provided with a bonding layer (3) and a conductor pattern (41) that is bonded to the bonding layer (3). The surface roughness of a bonding surface (42) of the conductive conductor (41), said bonding surface being bonded to the bonding layer (3), is higher than the surface roughnesses of surfaces other than the bonding surface (42) of the conductor pattern (41).