| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer, which enables simple manufacturing of a semiconductor chip having a highly uniform thickness and excellent printing precision; and in which the protective film forming layer is cured and adhesion of a pressure-sensitive adhesive sheet is reduced in a heating process thereby to achieve easy pickup of the semiconductor chip having the protective film and a simple manufacturing process of the semiconductor chip.SOLUTION: A dicing sheet with a protective film forming layer comprises: a pressure-sensitive adhesive sheet 3 which includes a base film 1 and an adhesive layer 2; a heat-curable protective film forming layer 4 which is to be a protective film by heating and which is formed on the adhesive layer of the pressure-sensitive adhesive sheet 3. An adhesive strength between the pressure-sensitive sheet 3 and the protective film is reduced by heating. And a heat generation occurrence temperature of the heat-curable protective film forming layer 4 is lower than an adhesive strength reduction temperature. |
