| 摘要 |
PROBLEM TO BE SOLVED: To provide a molded semiconductor device which corresponds to a high temperature and has high reliability.SOLUTION: A semiconductor device comprises: a semiconductor element 5 which has an electrode formed on a principal surface 5a and a rear face bonded to a circuit surface 6f of a heat spreader 6; a lead frame 3 bonded to the electrode; a coating body 2 which covers the circuit surface 6f so as to surround the semiconductor element 5; and an encapsulation body 1 for encapsulating and wrapping a part of the lead frame, which is bonded to the electrode on the principal surface 5a and the semiconductor element 5 and the coating body 2. The coating body 2 is formed by a material having an elastic modulus lower than that of the encapsulation body 1 and formed at a distance from the semiconductor element 5 in an extension direction of the circuit surface 6f and formed to have a height equal to or higher than a height of the principal surface 5a of the semiconductor element in a height direction from the circuit surface 6f so as not to reach a surface 1f of the encapsulation body 1. |
