发明名称 MULTISTAGE SUBSTRATE CONNECTION STRUCTURE, AND ELECTRIC CONNECTION BOX
摘要 PROBLEM TO BE SOLVED: To provide a multistage substrate connection structure capable of reducing penetration parts of a terminal and also improving electrical connection quality, and an electric connection box.SOLUTION: A multistage substrate connection structure 24 is configured to dispose at least a first substrate 33 and a second substrate 41 in a multistage manner while spacing the substrates in a plate thickness direction and electrically connect the substrates. The first substrate 33 includes a male penetration terminal 40 that protrudes from the first substrate 33, and the second substrate 41 includes a female terminal fitting 42 that is matched to the male penetration terminal 40. The first substrate 33 and the second substrate 41 include a flexible circuit 43 that is electrically connected thereto and can be bent. In the multistage substrate connection structure 24 in such a configuration, when the second substrate 41 is made opposite to a terminal disposed surface of the first substrate 33 in such a manner that the flexible circuit 43 is bent, the male penetration terminal 40 penetrates into the female terminal fitting 42 and is electrically connected. The first substrate 33 and the second substrate 41 are electrically connected by the male penetration terminal 40, the female terminal fitting 42 and the flexible circuit 43.SELECTED DRAWING: Figure 1
申请公布号 JP2016207259(A) 申请公布日期 2016.12.08
申请号 JP20150083027 申请日期 2015.04.15
申请人 YAZAKI CORP 发明人 TAKAHASHI HIDEO;SATO KOKI;KAWAMURA ATSUSHI;SHIBATA MASAO;OSHITA CHIKAFUMI;SEKIZAWA SHOGO
分类号 H01R12/51;H02G3/16;H05K1/14 主分类号 H01R12/51
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