发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION, BOARD WITH PHOTOSENSITIVE FILM, RESIST PATTERN FORMING METHOD AND METHOD FOR PREPARING THE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a positive type photoresist composition capable of forming a space pattern excellent in heat resistance and having a high aspect ratio on a thick film board with good perpendicularity and resolution and to provide a board with a photosensitive film, a resist pattern forming method and a method for preparing the photoresist composition. SOLUTION: The positive type photoresist composition contains an alkali- soluble novolak resin in which part of the hydrogen atoms of all hydroxyl groups have been substituted by 1,2-naphthoquinonediazidosulfonyl groups, The novolak resin has an Mw of 4,000-5,000 and an Mw to Mn ratio of <=3.0 and is, e.g. represented by formula (1).
申请公布号 JP2001312059(A) 申请公布日期 2001.11.09
申请号 JP20000132406 申请日期 2000.05.01
申请人 TOKYO OHKA KOGYO CO LTD 发明人 MASUDA YASUO;KATANO AKIRA;DOI KOSUKE;OBARA HIDEKATSU
分类号 G03F7/023;C08G8/28;C08L61/14;G03F7/40;H01L21/027 主分类号 G03F7/023
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