| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip part manufacturing method, with which a high quality of chip part can be manufactured without malfunctions being generated, when a substrate is cut. SOLUTION: When repeating the operation of cutting a plurality of lines in X-Y directions from the line close to the side edge of a substrate to the final line, the cutting operation of the next lines is performed after insulation of the wire material for prevention of blurring into the cutting traces 5 formed on the front line, and the next line is cut into a state wherein the substrate is supported by a wire material 6. Accordingly, the generation of blurring for a cutting piece 1a can be completely prevented by the wiring material 5 even if vibration and cutting stress, etc., are added in the cource of cutting, a highly precise chip having no chipping and a dimensional fault can be obtained, and high quality chip part can be manufactured.</p> |
