| 摘要 |
<p>PURPOSE:To prevent a relatively thin wafer and a compound semiconductor which easily cracks from being damaged due to suction. CONSTITUTION:A carrier for a wafer from one working process to another is constituted of a suction part 2 for retaining the wafer and a carrier part and the suction part 2 is formed by a porous member 4 and at the same time a buffer material 3 is included between the suction part and the carrier part.</p> |
