WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES

摘要

Some embodiments are directed to a wafer polishing tool. The wafer polishing tool includes a first polisher, a second polisher downstream of the first polisher, a third polisher downstream of the second polisher, and a fourth polisher downstream of the third polisher. The first polisher receives a wafer having a front side and a back side with integrated circuit component devices disposed on the front side of the wafer, and polishes a center region on the back side of the wafer. The second polisher receives the wafer via transporting equipment and buffs the center region of the back side of the wafer. The third polisher receives the wafer via the transporting equipment and polishes a back side edge region of the wafer. The fourth polisher receives the wafer via the transporting equipment and buffs the back side edge region of the wafer.

主权项

1. A wafer polishing tool, comprising:
a first polisher configured to receive a wafer having a front side and a back side with integrated circuit component devices disposed on the front side of the wafer, the first polisher configured to polish a center region on the back side of the wafer; a second polisher, downstream of the first polisher, configured to receive the wafer via transporting equipment and buff the center region of the back side of the wafer; a third polisher, downstream of the second polisher, configured to receive the wafer via the transporting equipment and polish a back side edge region of the wafer; and a fourth polisher, downstream of the third polisher, configured to receive the wafer via the transporting equipment and buff the back side edge region of the wafer.