Bonding method, bonding apparatus, and method for manufacturing substrate

摘要

A bonding method for bonding a semiconductor chip to an underlying structure includes aligning an electrical contact of a lower surface of the semiconductor chip with an electrical connection member of an upper surface of the underlying structure, the electrical contact at least partially encased by a support material. The method further includes first heating the semiconductor chip and the underlying structure, deforming the electrical contact, and curing the support material encasing the deformed electrical contact. The method still further includes second heating the semiconductor chip and the underlying structure to bond the electrical contact of the semiconductor chip to the electrical connection member of the underlying structure while maintaining the support material in a cured state.

主权项

1. A stage configured to exert pressure on upper surfaces of a plurality of semiconductor devices in a processing apparatus, the support stage comprising:
a support body including a support surface; an elastic plate located on the support surface of the support body; and an elastic sheet located on the support surface of the support body, wherein the support surface includes a plurality of protrusions each having four side surfaces projecting from the support surface towards the elastic sheet, and a rectangular protrusion surface spanning the side surfaces and confronting the elastic sheet, and the plurality of protrusions are disposed in an array and are arranged such that the protrusion surfaces respectively align with the upper surfaces of the plurality of semiconductor devices simultaneously processed by the processing apparatus.