| 发明名称 |
CHIP PACKAGE AND METHOD FOR FORMING THE SAME |
| 摘要 |
A chip package is provided. The chip package includes a substrate. The substrate includes a sensing region or device region. The chip package also includes a first conducting structure disposed on the substrate. The first conducting structure is electrically connected to the sensing region or device region. The chip package further includes a passive element vertically stacked on the substrate. The passive element and the first conducting structure are positioned side by side. |
| 申请公布号 |
US2017117242(A1) |
申请公布日期 |
2017.04.27 |
| 申请号 |
US201615297490 |
申请日期 |
2016.10.19 |
| 申请人 |
XINTEC INC. |
发明人 |
HO Yen-Shih;LIU Tsang-Yu;LEE Po-Han;LIAO Chi-Chang |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
a substrate comprising a sensing region or device region; a first conducting structure on the substrate, wherein the first conducting structure is electrically connected to the sensing region or device region; and a passive element vertically stacked on the substrate, wherein the passive element and the first conducting structure are positioned side by side. |
| 地址 |
Taoyuan City TW |
