| 发明名称 |
UNDERLAYMENT FOR A FLOOR |
| 摘要 |
An underlayment for a floor includes a dimpled substrate having a generally planar top side, an opposed bottom side, and a plurality of dimples formed therein. Each dimple is bounded by a dimple wall, and includes a dimple opening along the top side. A smoothing layer is bonded to the top side of the dimpled substrate and overlays and occludes the dimple openings. |
| 申请公布号 |
US2017114551(A1) |
申请公布日期 |
2017.04.27 |
| 申请号 |
US201615346008 |
申请日期 |
2016.11.08 |
| 申请人 |
DMX Plastics Limited |
发明人 |
Sennik Sundeepan |
| 分类号 |
E04F15/18;B32B5/18;B32B3/30;E04F15/22 |
主分类号 |
E04F15/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An underlayment for a floor comprising:
a) a dimpled substrate comprising a generally planar top side directed, in use, toward a finished flooring product installable upon the top side, and an opposed bottom side having a plurality of dimples projecting therefrom to bear against a base surface, each dimple bounded by a dimple wall, and comprising a dimple opening along the top side; and b) a smoothing layer bonded to the top side of the dimpled substrate and overlaying and occluding the dimple openings. |
| 地址 |
Brampton CA |
