WAFER LEVEL PACKAGE WITH TSV-LESS INTERPOSER

摘要

A semiconductor device includes an interposer having a first side and a second side opposite to the first side; a first semiconductor die mounted on the first side within a first chip mounting area through a plurality of first bumps; a second semiconductor die mounted on the first side within a second chip mounting area being adjacent to the first chip mounting area; a ring-shaped supporting feature disposed on the first side and encompassing the first chip mounting area and the second chip mounting area; and a plurality of solder bumps mounted on the second side.

主权项

1. A semiconductor device, comprising:
an interposer having a first side and a second side opposite to the first side; a first semiconductor die mounted on the first side within a first chip mounting area through a plurality of first bumps, wherein the first semiconductor die has a top surface and sidewall surfaces contiguous with the top surface; a second semiconductor die mounted on the first side within a second chip mounting area being adjacent to the first chip mounting area; a shielding feature directly disposed on the top surface and the sidewall surfaces of the first semiconductor die; a ring-shaped supporting feature disposed on the first side and encompassing the first chip mounting area and the second chip mounting area; and a plurality of solder bumps mounted on the second side.