发明名称 PRINTED CIRCUIT BOARD INSULATION STRUCTURE FOR ELECTRONIC DEVICE
摘要 A printed circuit board is fixed to a resin insulation plate by using a first metal screw, and a metal casing is fixed to the resin insulation plate by using a second metal screw. The cuboid insulation plate is arranged to match the shapes of the long sides of the printed circuit board and the metal casing necessary for screw fixation. The first and second metal screws are attached to the resin insulation plate with a lateral shift. This makes it possible to reduce the insulation distance around the first metal screw on the printed circuit board and to increase the wiring pattern area and the component mounting space, realizing a reduction in the size of an electronic device.
申请公布号 US2017110822(A1) 申请公布日期 2017.04.20
申请号 US201615253106 申请日期 2016.08.31
申请人 FUJI ELECTRIC CO., LTD. 发明人 KUWABARA Takashi;YAMADA Ryuji
分类号 H01R13/424;H05K7/14;H01B17/14;H05K5/04 主分类号 H01R13/424
代理机构 代理人
主权项 1. A printed circuit board insulation structure for an electronic device and for fixing a printed circuit board in the electronic device to a metal casing, the printed circuit board insulation structure comprising: a resin insulation plate having first and second helical inserts embedded in the insulation plate; a metal screw including a first screw and a second screw, the first and second screws are respectively fastened to the first and second helical inserts embedded in the insulation plate, and fastening positions of the first and second screws to the insulation plate are arranged with a lateral shift on the insulation plate, and wherein a lateral distance between the first and second helical inserts is equal to or greater than at least one of a distance between a bottom surface of the first helical insert and the metal casing, anda distance between a bottom surface of the second helical insert and the printed circuit board, the metal screw and the resin insulation plate fix the printed circuit board in the electronic device to the metal casing.
地址 Kawasaki-shi JP