SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

摘要

Implementations of a semiconductor device package may include: a plurality of electrical contacts on a first face of a die, at least one clip electrically and mechanically coupled with at least one electrical contact on a second face of the die where the second face of the die is on an opposing side of the die from the first face of the die. The at least one clip may include at least one lead in electrical communication with the at least one electrical contact on the second face of the die. A mold compound or an encapsulating compound may be included around the die and a majority of the at least one clip where a portion of the at least one lead and a portion of the plurality of electrical contacts on the first face of the die are not overmolded or encapsulated. The semiconductor package includes no lead frame.

主权项

1. A semiconductor device package consisting of:
at least one die comprising at least one electrical contact; at least one clip comprising at least one electrical contact mechanically and electrically coupled with the at least one die; one of an overmolding or an encapsulating compound comprised around the at least one die and a majority of the at least one clip, wherein the at least one electrical contact of the at least one die and the electrical contact of the at least one clip are not one of overmolded and encapsulated; wherein the at least one electrical contact of the at least one die and the electrical contact of the at least one clip are configured to be positioned to electrically couple with one or more conductive paths comprised in a motherboard, the one or more conductive paths forming a distribution layer; wherein the distribution layer is configured to distribute all electrical signals between the semiconductor device package and the motherboard; and wherein the semiconductor device package comprises no lead frame.