| 发明名称 | Supporting member separation method | ||
| 摘要 | A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment. | ||
| 申请公布号 | US9627235(B2) | 申请公布日期 | 2017.04.18 |
| 申请号 | US201514698049 | 申请日期 | 2015.04.28 |
| 申请人 | TOKYO OHKA KOGYO CO., LTD. | 发明人 | Iwata Yasumasa;Inao Yoshihiro;Nakamura Akihiko;Takase Shinji;Yoshioka Takahiro |
| 分类号 | H01L21/683;B32B43/00;H01L21/67;B32B37/02;B32B38/10;B32B38/18;B32B37/26 | 主分类号 | H01L21/683 |
| 代理机构 | Knobbe Martens Olson & Bear LLP | 代理人 | Knobbe Martens Olson & Bear LLP |
| 主权项 | 1. A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support which supports the substrate through an adhesive layer and in which a release layer is provided on the entire surface of the side of the substrate facing the support or on the entire surface of the side of the support facing the substrate, the method comprising: reducing the adhesive force of only an entire perimeter of the peripheral portion of the release layer which is provided on the substrate or the support or reducing the adhesive force of only a part of the peripheral portion; and fixing a part of the substrate and the support and separating the support from the substrate by applying a force to another part. | ||
| 地址 | Kawasaki-Shi JP | ||