Adaptor structure and apparatus for testing a semiconductor package including the same

摘要

An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

主权项

1. An adaptor comprising:
a main adaptor over a socket for testing a semiconductor package, the main adaptor having an opening configured to expose the socket; a first sub-adaptor received movably in the opening of the main adaptor along a first direction in which the semiconductor package is loaded into the socket, the first sub-adaptor configured to support a first side surface of the semiconductor package; a second sub-adaptor received movably in the opening of the main adaptor along the first direction and a second direction substantially perpendicular to the first direction and towards the first sub-adaptor, the second sub-adaptor facing the first sub-adaptor to support a second side surface of the semiconductor package opposite to the first side surface of the semiconductor package; and a first driving mechanism configured to move the second sub-adaptor in the second direction.