METHOD OF MANUFACTURING ELECTRONIC DEVICE AND COMPOSITE FILM

摘要

Provided is a method of manufacturing an electronic device including: drying a pressure sensitive adhesive layer of a composite film which has the pressure sensitive adhesive layer; and a first film and a second film bonded to each surface of the pressure sensitive adhesive layer and in which a moisture vapor transmission rate of the first film at a temperature of 40° C. and a relative humidity of 90% is 100 g/(m2·day) or greater; peeling the first film from the composite film in which the pressure sensitive adhesive layer is dried; and bonding the composite film from which the first film is peeled to an electronic device. In this manner, deterioration of the electronic device due to moisture can be prevented during the manufacture of a laminated electronic device formed by sealing the electronic device with a gas barrier film or the like.

主权项

1. A method of manufacturing an electronic device comprising:
a drying step of drying a pressure sensitive adhesive layer of a composite film which has the pressure sensitive adhesive layer, a first film bonded to one surface of the pressure sensitive adhesive layer, and a second film bonded to a surface of the pressure sensitive adhesive layer on the opposite side to the first film and in which a moisture vapor transmission rate of the first film at a temperature of 40° C. and a relative humidity of 90% is 100 g/(m2·day) or greater; a peeling step of peeling the first film from the composite film in which the pressure sensitive adhesive layer is dried; and a bonding step of bonding the composite film from which the first film is peeled to an electronic device body while facing the pressure sensitive adhesive layer toward the electronic device body.