| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME |
| 摘要 |
A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor body and a conductive structure disposed below the semiconductor body. The semiconductor package structure also includes an insulating layer surrounding the conductive structure. The semiconductor package structure further includes a redistribution layer structure coupled to the conductive structure. In addition, the semiconductor package structure includes a molding compound surrounding the semiconductor body. A portion of the molding compound extends between the redistribution layer structure and the semiconductor body. |
| 申请公布号 |
US2017098628(A1) |
申请公布日期 |
2017.04.06 |
| 申请号 |
US201615212125 |
申请日期 |
2016.07.15 |
| 申请人 |
MediaTek Inc. |
发明人 |
LIU Nai-Wei;LIN Tzu-Hung;PENG I-Hsuan;HSIAO Ching-Wen;HUANG Wei-Che |
| 分类号 |
H01L25/065;H01L23/498;H01L21/56;H01L23/00;H01L23/31 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package structure, comprising:
a semiconductor body; a conductive structure disposed below the semiconductor body; an insulating layer surrounding the conductive structure; a redistribution layer structure coupled to the conductive structure; and a molding compound surrounding the semiconductor body, wherein a portion of the molding compound extends between the redistribution layer structure and the semiconductor body. |
| 地址 |
Hsin-Chu TW |
