Semiconductor device

摘要

A semiconductor device includes a resin package, a semiconductor chip sealed in the package and having first and second pads on a front surface. An island of the device has a projecting terminal sealed in the package, to one surface of which a back surface of the chip is bonded, and the other surface of which is partially exposed from a bottom surface of the package as a first terminal. A lead separate from the island is sealed in the package and has one surface electrically connected with the second pad, and another surface exposed from the package bottom surface as a second terminal capable of electrical connection between the second pad and outside. A mass center of the chip is away from a center of the package, the projecting terminal is as large as the lead, and solder under the device spreads to the island projecting terminal.

主权项

1. A semiconductor device comprising:
a resin package; a semiconductor chip sealed in the resin package, and having first and second pads on a front surface; an island with a projecting terminal, sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and another surface of which is partially exposed from a bottom surface of the resin package as a first terminal; and a lead formed separately from the island with the projecting terminal, sealed in the resin package, one surface of the lead being electrically connected with the second pad, and another surface of which being exposed from the bottom surface of the resin package as a second terminal capable of providing electrical connection between the second pad and outside, wherein a center of mass of the semiconductor chip is away from a center of the resin package and the projecting terminal is equally as large as the lead.