SUPPORT STAND APPARATUS AND METHOD TO ENHANCE COOLING AND HEAT DISSIPATION OF ELECTRONIC DEVICES

摘要

This invention relates to devices that promote cooling and heat dissipation of electronic devices. Previously, electronic devices overheated when put on a flat surface. Embodiments of the present invention use a base member (14) having a top face, a bottom face and side faces connecting the top and bottom faces. The top face has a concave surface (16) and the bottom face has a slot (18). A magnet (20) is disposed within the slot and coupled to the base member. A metallic member (22) is detachably coupled to a bottom portion of the electronic device and has a convex surface. The base member is oriented to permit the concave surface of the top face to receive the convex surface of the metallic member to support the electronic device in an elevated position above the flat surface.