| 发明名称 |
FLEXIBLE HEAT TRANSFER STRUCTURE |
| 摘要 |
A heat transfer structure, including: a plurality of layers of graphite material each having a shape selected for providing a thermal path between a hotspot in an electronic device and a heat dissipating structure of the electronic device; and a set of intervening bonding layers for coupling together the layers of graphite material such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure. |
| 申请公布号 |
US2017089650(A1) |
申请公布日期 |
2017.03.30 |
| 申请号 |
US201514864483 |
申请日期 |
2015.09.24 |
| 申请人 |
Jones Tech (USA), Inc. |
发明人 |
Wu Xiaoning |
| 分类号 |
F28F21/02 |
主分类号 |
F28F21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat transfer structure for an electronic device, comprising:
a plurality of layers of graphite material each having a shape selected for providing a thermal path between a hotspot in the electronic device and a heat dissipating structure of the electronic device; and a set of intervening bonding layers for coupling together the layers of graphite material such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure. |
| 地址 |
Cupertino CA US |
