METHOD OF MANUFACTURING GLASS SUBSTRATE WITH THROUGH HOLE, METHOD OF MANUFACTURING GLASS SUBSTRATE INCLUDING THROUGH ELECTRODE, AND METHOD OF MANUFACTURING INTERPOSER

摘要

Disclosed is a method of manufacturing a glass substrate with a through hole, the glass substrate having a thickness of θf, the method including (1) adjusting a first thickness θ1 of the glass substrate having first and second surfaces facing each other to be a second thickness θ2 (θ2<θ1); (2) forming one or more through holes in the glass substrate by irradiating a laser beam from the first surface of the glass substrate; and (3) wet-etching the glass substrate with the through hole to adjust a size of the through hole to be a predetermined size, so that the thickness of the glass substrate is adjusted from θ2 to the target value of θf.

主权项

1. A method of manufacturing a glass substrate with a through hole, the glass substrate having a thickness of θf, the method comprising:
(1) adjusting a first thickness θ1 of the glass substrate having first and second surfaces facing each other to be a second thickness θ2 (θ2<θ1); (2) forming one or more through holes in the glass substrate by irradiating a laser beam from the first surface of the glass substrate; and (3) wet-etching the glass substrate with the through hole to adjust a size of the through hole to be a predetermined size, so that the thickness of the glass substrate is adjusted from θ2 to the target value of θf.