Electrical connector with laser soldering and method for assembling the same

摘要

An electrical connector for electrically connecting a chip module and a circuit board, includes an insulating body, multiple terminals, and multiple solders. The insulating body includes multiple receiving holes running therethrough and multiple resisting portions. The terminals are respectively located in the receiving holes. One end of each terminal is provided with a soldering portion, the soldering portion has a soldering surface, and the soldering surface is perpendicular to a surface of the circuit board. Left and right sides of the solder urge the soldering surface and the resisting portion respectively, a lower side of the solder is soldered onto the circuit board by reflow soldering, and the solder is soldered to the soldering surface by laser.

主权项

1. An electrical connector for electrically connecting a mating element and a circuit board, comprising:
an insulating body, having a plurality of receiving holes running therethrough and a plurality of resisting portions; a plurality of terminals, respectively received in the receiving holes, wherein one end of each of the terminals is provided with a soldering portion, a side of the soldering portion has a soldering surface, and the soldering surface is perpendicular to a surface of the circuit board; and a plurality of solders for being soldered onto the surface of the circuit board downward, wherein two sides of each of the solders respectively press against the soldering surface and corresponding one of the resisting portions, and each of the solders is soldered to the soldering surface by means of laser, wherein the insulating body further comprises a reserved space at a side of the soldering surface, and when the solder is loaded, the solder presses against the soldering portion, so that the soldering portion elastically moves toward the reserved space, and during the soldering of the solder to the soldering surface by means of laser, the soldering portion elastically moves in a direction away from the reserved space toward the solder.