Electric-programmable magnetic module and picking-up and placement process for electronic devices

摘要

A picking-up and placement process for electronic devices comprising: (a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion; (b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and (c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate.

主权项

1. A picking-up and placement process for electronic devices, comprising:
(a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion; (b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and (c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate,
wherein a method for fabricating the first substrate having the electronic devices thereon comprises:forming a photoelectric semiconductor layer on a growth substrate;forming a plurality of electrodes on the photoelectric semiconductor layer;bonding the photoelectric semiconductor layer with the first substrate through an adhesive, wherein the adhesive adheres with the electrodes and the photoelectric semiconductor layer and is between the photoelectric semiconductor layer and the first substrate;removing the growth substrate to expose a surface of the photoelectric semiconductor layer;forming a sacrificial layer on the surface of the photoelectric semiconductor layer;forming the magnetic portions on the sacrificial layer;patterning the photoelectric semiconductor layer, the adhesive and the sacrificial layer to form the electronic devices, a plurality of sacrificial patterns disposed on the electronic devices and a plurality of adhesion patterns disposed between the electronic devices and the first substrate;forming a supporting layer on the first substrate, wherein the supporting layer is between and connects the electronic devices, and each of the adhesion patterns is exposed by the supporting layer; andremoving the adhesion patterns to form a gap between each of the electronic devices and the first substrate.