Light Emitting Diode Device

摘要

A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.

主权项

1. A light emitting diode (LED) device, comprising:
a substrate comprising a first surface, a second surface opposite to the first surface, and a plurality of vias disposed between the first surface and the second surface; a plurality of metal pads comprising a plurality of first metal pads disposed on the first surface and a plurality of second metal pads disposed on the second surface respectively, the vias electrically connecting the first metal pads disposed on the first surface and the second metal pads disposed on the second surface; and a plurality of LED chips each of which comprising at least one first electrode contact and at least one second electrode contact, wherein the LED chips are disposed on a part of the first metal pads that are separate from each other, wherein the second electrode contacts of the LED chips are electrically connected to the part of the first metal pads respectively, and wherein the first electrode contacts of the LED chips are electrically connected to another of the first metal pads other than the part of the first metal pads, wherein at least one of the LED chips is a flip chip, and wherein the flip chip extends across a gap between the first metal pad on which the flip chip is disposed and the first metal pad on which no flip-chip LED chip is disposed so that the first electrode contact of the flip chip is electrically connected to the another first metal pad.